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74HC3GU04
Inverter
Rev. 04. -- 11 January 2010 Product data sheet
1. General description
The 74HC3GU04 is a high-speed Si-gate CMOS device. This device provides three inverter gates with unbuffered outputs. The 74HC3GU04 has CMOS input switching levels and supply voltage range 2 V to 6 V.
2. Features
Wide supply voltage range from 2.0 V to 6.0 V Symmetrical output impedance High noise immunity Low-power dissipation Balanced propagation delays Multiple package options ESD protection: HBM JESD22-A114F exceeds 2 000 V MM JESD22-A115-A exceeds 200 V Specified from -40 C to +85 C and -40 C to +125 C
3. Ordering information
Table 1. Ordering information Package Temperature range 74HC3GU04DP 74HC3GU04DC 74HC3GU04GD -40 C to +125 C -40 C to +125 C -40 C to +125 C Name TSSOP8 VSSOP8 XSON8U Description plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm Version SOT505-2 Type number
plastic very thin shrink small outline package; 8 leads; SOT765-1 body width 2.3 mm plastic extremely thin small outline package; no leads; SOT996-2 8 terminals; UTLP based; body 3 x 2 x 0.5 mm
4. Marking
Table 2. Marking Marking code HU4 HU4 HU4 Type number 74HC3GU04DP 74HC3GU04DC 74HC3GU04GD
NXP Semiconductors
74HC3GU04
Inverter
5. Functional diagram
1
1
7
1
1A
1Y
7 3 1 5
3
2A
2Y
5 1
6
3A
3Y
2
6
2
mna720
mna721
Fig 1.
Logic symbol
Fig 2.
IEC logic symbol
6. Pinning information
6.1 Pinning
74HC3GU04
1A 1 2 3 4 8 7 6 5 VCC 1Y 3A 2Y
74HC3GU04
1A 3Y 2A GND 1 2 3 4
001aak022
3Y 8 7 6 5 VCC 1Y 3A 2Y 2A GND
001aak023
Transparent top view
Fig 3.
Pin configuration SOT505-2 (TSSOP8) and SOT765-1 (VSSOP8)
Fig 4.
Pin configuration SOT996-2 (XSON8U)
6.2 Pin description
Table 3. Symbol 1A, 2A, 3A 1Y, 2Y, 3Y GND VCC Pin description Pin 1, 3, 6 7, 5, 2 4 8 Description data input data output ground (0 V) supply voltage
74HC3GU04_4
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Product data sheet
Rev. 04 -- 11 January 2010
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74HC3GU04
Inverter
7. Functional description
Table 4. Input nA L H
[1] H = HIGH voltage level; L = LOW voltage level.
Function table [1] Output nY H L
8. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC IIK IOK IO ICC IGND Tstg Ptot
[1] [2]
Parameter supply voltage input clamping current output clamping current output current quiescent supply current ground current storage temperature total power dissipation
Conditions VI < -0.5 V or VI > VCC + 0.5 V VO < -0.5 V or VO > VCC + 0.5 V VO = -0.5 V to (VCC + 0.5 V)
[1] [1] [1] [1] [1]
Min -0.5 -50 -65 -
Max +7.0 20 20 25 50 +150 300
Unit V mA mA mA mA mA C mW
Tamb = -40 C to +125 C
[2]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed. For TSSOP8 package: above 55 C the value of Ptot derates linearly with 2.5 mW/K. For VSSOP8 package: above 110 C the value of Ptot derates linearly with 8 mW/K. For XSON8U package: above 118 C the value of Ptot derates linearly with 7.8 mW/K.
9. Recommended operating conditions
Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol VCC VI VO Tamb t/V Parameter supply voltage input voltage output voltage ambient temperature input transition rise and fall rate VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V Conditions Min 2.0 0 0 -40 Typ 5.0 +25 1.67 Max 6.0 VCC VCC +125 625 139 83 Unit V V V C ns/V ns/V ns/V
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Product data sheet
Rev. 04 -- 11 January 2010
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74HC3GU04
Inverter
10. Static characteristics
Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol VIH Parameter HIGH-level input voltage Conditions VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VIL LOW-level input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VOH HIGH-level output voltage VI = VIH or VIL IO = -20 A; VCC = 2.0 V IO = -20 A; VCC = 4.5 V IO = -20 A; VCC = 6.0 V IO = -4.0 mA; VCC = 4.5 V IO = -5.2 mA; VCC = 6.0 V VOL LOW-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 4.0 mA; VCC = 4.5 V IO = 5.2 mA; VCC = 6.0 V II ICC CI
[1]
-40 C to +85 C Min 1.7 3.6 4.8 1.9 4.4 5.9 4.13 5.63 Typ[1] 1.1 2.4 3.1 0.9 2.1 2.9 2.0 4.5 6.0 4.32 5.81 0 0 0 0.15 0.16 3.0 Max 0.3 0.9 1.2 0.1 0.1 0.1 0.33 0.33 1.0 10 -
-40 C to +125 C Min 1.7 3.6 4.8 1.9 4.4 5.9 3.7 5.2 Max 0.3 0.9 1.2 0.1 0.1 0.1 0.4 0.4 1.0 20 -
Unit V V V V V V V V V V V V V V V V A A pF
input leakage current supply current input capacitance
VI = VCC or GND; VCC = 6.0 V per input pin; VI = VCC or GND; IO = 0 A; VCC = 6.0 V
All typical values are measured at Tamb = 25 C.
11. Dynamic characteristics
Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 6. Symbol Parameter tpd Conditions
[2]
-40 C to +85 C Min Typ[1] 13 6 5 Max 75 15 13
-40 C to +125 C Unit Min Max 90 18 15 ns ns ns
propagation delay nA to nY; see Figure 5 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V
-
74HC3GU04_4
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 -- 11 January 2010
4 of 16
NXP Semiconductors
74HC3GU04
Inverter
Table 8. Dynamic characteristics ...continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 6. Symbol Parameter tt transition time Conditions nY; see Figure 5 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V CPD power dissipation VI = GND to VCC capacitance
All typical values are measured at Tamb = 25 C. tpd is the same as tPLH and tPHL. tt is the same as tTLH and tTHL. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi x N + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL x VCC2 x fo) = sum of outputs.
[4] [3]
-40 C to +85 C Min Typ[1] 18 6 5 5 Max 95 19 16 -
-40 C to +125 C Unit Min Max 125 25 20 ns ns ns pF
[1] [2] [3] [4]
12. Waveforms
VI nA input GND t PHL VOH nY output VOL t THL VM VM
10 %
VM
VM
t PLH
90 %
t TLH
mna722
Measurement points are given in Table 9.
Fig 5. Table 9. Type
Propagation delay data input (nA) to data output (nY) and transition time output (nY) Measurement points Input VM 0.5 x VCC Output VM 0.5 x VCC
74HC3GU04
74HC3GU04_4
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 -- 11 January 2010
5 of 16
NXP Semiconductors
74HC3GU04
Inverter
VI negative pulse 0V
tW 90 % VM 10 % tf tr tr tf 90 % VM 10 % tW VM VM
VI positive pulse 0V
VCC
VCC
G
VI
VO
RL
S1
DUT
RT CL
open
001aad983
Test data is given in Table 10. Definitions for test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistance. S1 = Test selection switch.
Fig 6. Table 10. Type
Test circuit for measuring switching times Test data Input VI tr, tf 6 ns GND to VCC Load CL 50 pF RL 1 k S1 position tPHL, tPLH open
74HC3GU04
74HC3GU04_4
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 -- 11 January 2010
6 of 16
NXP Semiconductors
74HC3GU04
Inverter
12.1 Additional characteristics
Rbias = 560 k
VCC
0.47 F
input
output
100 F
VI (f = 1 kHz)
A IO GND
mna050
I o g fs = -------V i
VO is constant.
Fig 7. Test set-up for measuring forward transconductance
30 gfs (mA/V) 20
mnb124
10
0 0 2 4 6 VCC (V) 8
Tamb = 25 C.
Fig 8. Typical forward transconductance as a function of supply voltage
74HC3GU04_4
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 -- 11 January 2010
7 of 16
NXP Semiconductors
74HC3GU04
Inverter
13. Typical transfer characteristics
mnb122
150 ICC (A) 120
mnb121
2 VO (V) 1.6
10 I CC (mA) 8
5 VO (V) 4
90
1.2
6
3
60
0.8
4
2
30
0.4
2
1
0 0 0.4 0.8 1.2 1.6 VI (V) 2
0
0 0 1 2 3 4 VI (V) 5
0
VCC = 2.0 V; IO = 0 A.
VCC = 4.5 V; IO = 0 A.
Fig 9.
Typical transfer characteristics VCC = 2.0 V
Fig 10. Typical transfer characteristics VCC = 4.5 V
20 I CC (mA) 16
mnb123
6
VO (V)
12 3 8
4
0
0 2 4 VI (V) 6
0
VCC = 6.0 V; IO = 0 A.
Fig 11. Typical transfer characteristics VCC = 6.0 V
14. Application information
Some applications for the 74HC3GU04 are:
* Linear amplifier (see Figure 12) * Crystal oscillator (see Figure 14).
74HC3GU04_4 (c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 -- 11 January 2010
8 of 16
NXP Semiconductors
74HC3GU04
Inverter
Remark: All values given are typical values unless otherwise specified.
R2
VCC
1 F R1
U04
ZL
mna052
ZL > 10 k. R1 3 k. R2 1 M. Open loop amplification: AOL = 20 (typical).
Voltage amplification: A V = - ---------------------------------------- . R1 1 + ------ ( 1 + AOL ) R2
Vo(p-p) = VCC - 1.5 V centered at 0.5 x VCC. Unity gain bandwidth product is 5 MHz (typical). Input capacitance see Figure 13.
A OL
Fig 12. Linear amplifier application
80 input capacitance (pF) 60
mna054
(1)
(2)
40
(3)
20
0 0 2 4 6 VI (V) 8
(1) VCC = 2.0 V. (2) VCC = 4.5 V. (3) VCC = 6.0 V.
Fig 13. Typical input capacitance as a function of the input voltage
74HC3GU04_4
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 -- 11 January 2010
9 of 16
NXP Semiconductors
74HC3GU04
Inverter
R1
R2
U04
C1 C2
out
mna053
Test data is given in Table 11 and Table 12. C1 = 47 pF (typical). C2 = 22 pF (typical). R1 = 1 M to 10 M (typical). R2 optimum value depends on the frequency and required stability against changes in VCC or average minimum ICC (ICC = 2 mA at VCC = 3.0 V and f = 1 MHz)
Fig 14. Crystal oscillator application Table 11. Frequency 10 kHz to 15.9 kHz 16 kHz to 24.9 kHz 25 kHz to 54.9 kHz 55 kHz to 129.9 kHz 130 kHz to 199.9 kHz 200 kHz to 349.9 kHz 350 kHz to 600 kHz Table 12. Frequency 3 kHz 6 kHz 10 kHz 14 kHz > 14 kHz External components for resonator (f < 1 MHz) R1 2.2 M 2.2 M 2.2 M 2.2 M 2.2 M 2.2 M 2.2 M R2 220 k 220 k 100 k 100 k 47 k 47 k 47 k C1 56 pF 56 pF 56 pF 47 pF 47 pF 47 pF 47 pF C2 20 pF 10 pF 10 pF 5 pF 5 pF 5 pF 5 pF
Optimum value for R2 R2 2.0 k 8.0 k 1.0 k 4.7 k 0.5 k 2.0 k 0.5 k 2.0 k Optimum minimum required ICC minimum influence due to change in VCC minimum required ICC minimum influence by VCC minimum required ICC minimum influence by VCC minimum required ICC minimum influence by VCC
replace R2 by C3 = 35 pF (typical)
74HC3GU04_4
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 -- 11 January 2010
10 of 16
NXP Semiconductors
74HC3GU04
Inverter
15. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm SOT505-2
D
E
A
X
c y HE vMA
Z
8
5
A pin 1 index
A2 A1
(A3)
Lp L
1
e bp
4
wM
detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.00 A2 0.95 0.75 A3 0.25 bp 0.38 0.22 c 0.18 0.08 D(1) 3.1 2.9 E(1) 3.1 2.9 e 0.65 HE 4.1 3.9 L 0.5 Lp 0.47 0.33 v 0.2 w 0.13 y 0.1 Z(1) 0.70 0.35 8 0
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT505-2 REFERENCES IEC JEDEC --JEITA EUROPEAN PROJECTION ISSUE DATE 02-01-16
Fig 15. Package outline SOT505-2 (TSSOP8)
74HC3GU04_4 (c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 -- 11 January 2010
11 of 16
NXP Semiconductors
74HC3GU04
Inverter
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
SOT765-1
D
E
A X
c y HE vMA
Z
8
5
Q A pin 1 index A2 A1 (A3) Lp L
1
e bp
4
wM
detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1 A1 0.15 0.00 A2 0.85 0.60 A3 0.12 bp 0.27 0.17 c 0.23 0.08 D(1) 2.1 1.9 E(2) 2.4 2.2 e 0.5 HE 3.2 3.0 L 0.4 Lp 0.40 0.15 Q 0.21 0.19 v 0.2 w 0.13 y 0.1 Z(1) 0.4 0.1 8 0
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT765-1 REFERENCES IEC JEDEC MO-187 JEITA EUROPEAN PROJECTION
ISSUE DATE 02-06-07
Fig 16. Package outline SOT765-1 (VSSOP8)
74HC3GU04_4 (c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 -- 11 January 2010
12 of 16
NXP Semiconductors
74HC3GU04
Inverter
XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 3 x 2 x 0.5 mm
SOT996-2
D
B
A
E
A
A1
detail X terminal 1 index area e1 L1
1
e
b
4
v w
M M
CAB C
C y1 C y
L2
L
8 5
X
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.5 A1 0.05 0.00 b 0.35 0.15 D 2.1 1.9 E 3.1 2.9 e 0.5 e1 1.5 L 0.5 0.3 L1 0.15 0.05 L2 0.6 0.4 v 0.1 w 0.05 y 0.05 y1 0.1
OUTLINE VERSION SOT996-2
REFERENCES IEC --JEDEC JEITA ---
EUROPEAN PROJECTION
ISSUE DATE 07-12-18 07-12-21
Fig 17. Package outline SOT996-2 (XSON8U)
74HC3GU04_4 (c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 -- 11 January 2010
13 of 16
NXP Semiconductors
74HC3GU04
Inverter
16. Abbreviations
Table 13. Acronym CMOS DUT ESD HBM MM TTL Abbreviations Description Complementary Metal Oxide Semiconductor Device Under Test ElectroStatic Discharge Human Body Model Machine Model Transistor-Transistor Logic
17. Revision history
Table 14. Revision history Release date 20100111 Data sheet status Product data sheet Product data sheet Product specification Product specification Change notice Supersedes 74HC3GU04_3 74HC3GU04_2 74HC3GU04_1 Document ID 74HC3GU04_4 Modifications: 74HC3GU04_3 74HC3GU04_2 74HC3GU04_1
*
Marking code for 74HC3GU04DP package changed from HU04 to HU4
20090511 20031126 20030818
74HC3GU04_4
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 -- 11 January 2010
14 of 16
NXP Semiconductors
74HC3GU04
Inverter
18. Legal information
18.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
18.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
74HC3GU04_4
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 -- 11 January 2010
15 of 16
NXP Semiconductors
74HC3GU04
Inverter
20. Contents
1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 12.1 13 14 15 16 17 18 18.1 18.2 18.3 18.4 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 3 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 4 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Additional characteristics . . . . . . . . . . . . . . . . . 7 Typical transfer characteristics . . . . . . . . . . . . 8 Application information. . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 11 January 2010 Document identifier: 74HC3GU04_4

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